Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper
Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f
Used SMT Equipment | Coating and Encapsulation
PVA INLINE IR CURING OVEN FOR SALE, TWO 4 FOOT TOP SIDE ONLY IR CURING ELEMENTS. IN GOOD WORKING CONDITION. MADE IN 1997 SELLING DUE TO UPGRADE, ASKING PRICE IS $5,000 PLEASE CONTACT RYAN AT RYAN.MATURI@CREATIONTECH.COM
Used SMT Equipment | Pick and Place/Feeders
Model: NXT M3II Mounting speed: 1608 Chip 21,000CPH 1005 Chip 20,000 CPH SOP16:15,000 CPH/feeder QFP100:5,000 CPH/tray Component recognition range: V12/H12HS :0402~7.5mm×7.5mm H08M :0603~45mm×45mm H08 :0402~12mm×12mm H04
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2019-05-05 19:06:43.0
IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” in Boston, the Chicago area and San Jose on June 3, 5, and 7, respectively. The series will feature well-known United Kingdom (UK) regulators Carl Magness, product safety enforcement team leader, and Paul Tennant, product safety enforcement manager, both within the UK Office of Business, Energy and Industrial Strategy (BEIS), and Giuseppina Luvara, a policy officer within the European Commission’s Directorate General of Environment.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/application-solutions/automotive-assembly/final-assembly-glass-application
SD3/XD3 Electric Unloaders and Rhino SD3/XD3 Pneumatic Unloaders can generate up to 5,000 psi on the thick urethane material and deliver it to the Pro-Meter G
Lewis & Clark | https://www.lewis-clark.com/
Used Surface Mount I Pre-owned PCB Assembly - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal